Core Technologies Of EPP Molding Machines

Core technologies include micron-level positioning, full-process automation, intelligent debris management, and durability and compatibility. Micron-level positioning utilizes high-precision servo motors and intelligent algorithms, achieving a positioning accuracy of ±0.01mm. Combined with a high-speed steel cutting blade and an adaptive cutting groove design, it enables burr-free and deformation-free cutting of flexible circuit boards, with a defect rate controlled below 0.1%. Full-process automation features a built-in rotary steering mechanism, enabling 360° rotational cutting of the circuit board, with a single-station changeover time of approximately 15 seconds. Intelligent debris management integrates a wind-powered cleaning system, simultaneously blowing away and collecting debris during cutting. Regarding durability and compatibility, the main body is constructed of aerospace-grade aluminum alloy with a corrosion-resistant coating. After 100,000 cycle tests, the deformation is less than 0.03mm, allowing it to handle flexible circuit boards with thicknesses ranging from 3 to 50mm.

 

EPP molding machine is a matching mold designed for PCB and FPC substrate separation. The matching equipment is FPC separation machine. It is mainly used in the electronics industry for the separation of mobile phone boards, memory cards, mobile phone flexible circuits and other products. Flexible circuit boards (FPC) are used in the industry because of their thinness and bendability. The mold is made of steel and manufactured through processing, electroplating and other processes. The main body is made of aerospace-grade aluminum alloy and corrosion-resistant coating.